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Solderless Cable-in-Conduit-Conductor (CICC) Joint

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Tech ID:
09-026
Principal Investigator:
Dr. Thomas Painter
Licensing Manager:
Patents:
Description:

The present invention describes a method of fabrication for a low-resistance, vacuum-tight electrical connection for a cable-in-conduit-conductor (CICC) joint for use with a hybrid magnet. An elongate copper member is disposed in sandwiched relation between a first and second cable that are disposed in parallel, spaced apart relation to one another. A first elongate member is disposed in overlying relation to the first cable and a second elongate member is disposed in underlying relation to the second cable. All of the parts are positioned within a joint box, and the joint box is sandwiched between first and second flat plates that are interconnected to one another by elongate bolts. Tightening the bolts compresses the parts within the joint box. A heat treatment completes the solderless joint.

Advantages:

  • Provides the low electrical resistances required for CICC magnets which in turn increases operational margins or decreases the cost of cryogenic refrigeration
  • Eliminates the need for vacuum leak-tight copper to stainless steel mechanical bonds, which reduces the operational risk of vacuum leak and costly remediation
  • Eliminates the need for solder filling, which reduces the risk during fabrication of the expensive superconductor typically costing more than $1m
  • Eliminates the need for post-heat treatment processing, which reduces the risk of handling the expensive superconductor in its brittle state and reduces fabrication costs by eliminating lengthy and problematic solder filling processes